Mfr. #:
EPC2010C
Description:
TRANS GAN 200V 22A BUMPED DIE
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Buy EPC2010C

Documents

NAMETYPE
DatasheetsEPC2010C Datasheet
Mfg Application NotesSecond Generation eGaN® FETs
Assembling eGaN® FETs
Die Attach Procedure
Die Removal Procedure
Using eGaN® FETs
Featured ProductEPC Low Voltage eGaN® FETs
EPC9052/53/54 Development Boards
Online CatalogN-Channel Standard FETs

Attributes

NAMETYPE
CategoryDiscrete Semiconductor Products
FamilyTransistors - FETs, MOSFETs - Single
ManufacturerEPC
SerieseGaN®
PackagingTape & Reel (TR)
Part StatusActive
FET TypeGaNFET N-Channel, Gallium Nitride
FET FeatureStandard
Drain to Source Voltage (Vdss)200V
Current - Continuous Drain (Id) @ 25°C22A (Ta)
Rds On (Max) @ Id, Vgs25 mOhm @ 12A, 5V
Vgs(th) (Max) @ Id2.5V @ 3mA
Gate Charge (Qg) @ Vgs5.3nC @ 5V
Input Capacitance (Ciss) @ Vds540pF @ 100V
Power - Max-
Operating Temperature-40°C ~ 150°C (TJ)
Mounting TypeSurface Mount
Package / CaseDie
Supplier Device PackageDie Outline (7-Solder Bar)

Resources

NAMETYPE
Standard Package500
Other Names917-1085-2
TagsEPC2010C EPC2010 EPC201 EPC20 EPC2 EPC

For Use With

Part NumberDescription
EPC9003CEPC2010C eGaN® Series Power Management, Half H-Bridge Driver (External FET) Evaluation Board

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Package

Part NumberDescription
EPC2010CTRANS GAN 200V 22A BUMPED DIE
EPC2010CTRANS GAN 200V 22A BUMPED DIE

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