Mfr. #:
EPC2012CENGR
Description:
TRANS GAN 200V 5A BUMPED DIE
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Buy EPC2012CENGR

Documents

NAMETYPE
DatasheetsEPC2012C Datasheet
Mfg Application NotesAssembling eGaN® FETs
Die Attach Procedure
Die Removal Procedure
Using eGaN® FETs
Featured ProductEPC Low Voltage eGaN® FETs

Attributes

NAMETYPE
CategoryDiscrete Semiconductor Products
FamilyTransistors - FETs, MOSFETs - Single
ManufacturerEPC
SerieseGaN®
PackagingTape & Reel (TR)
Part StatusActive
FET TypeGaNFET N-Channel, Gallium Nitride
FET FeatureStandard
Drain to Source Voltage (Vdss)200V
Current - Continuous Drain (Id) @ 25°C5A (Ta)
Rds On (Max) @ Id, Vgs100 mOhm @ 3A, 5V
Vgs(th) (Max) @ Id2.5V @ 1mA
Gate Charge (Qg) @ Vgs1nC @ 5V
Input Capacitance (Ciss) @ Vds100pF @ 100V
Power - Max-
Operating Temperature-40°C ~ 150°C (TJ)
Mounting TypeSurface Mount
Package / CaseDie
Supplier Device PackageDie Outline (4-Solder Bar)

Resources

NAMETYPE
Standard Package1,000
Other Names917-EPC2012CENGRTR
TagsEPC2012C EPC2012 EPC201 EPC20 EPC2 EPC

For Use With

Part NumberDescription
EPC9004CEPC2012C eGaN® Series Power Management, Half H-Bridge Driver (External FET) Evaluation Board

Package

Part NumberDescription
EPC2012CENGRTRANS GAN 200V 5A BUMPED DIE
EPC2012CENGRTRANS GAN 200V 5A BUMPED DIE

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